| ： | ADG3308BCBZ-1-REEL |
|---|---|
| ： | Logic ICs |
| ： | Analog Devices |
| ： | levels applied |
| ： | - |
| ： | 20-UFBGA, WLCSP |
| ： | YES |
| TYPE | DESCRIPTION |
| Manufacturer Part Number: | ADG3308BCBZ-1-REEL |
| Brand Name: | Analog Devices Inc |
| Pbfree Code: | No |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Active |
| Ihs Manufacturer: | ANALOG DEVICES INC |
| Part Package Code: | BGA |
| Package Description: | VFBGA, BGA20,4X5,20 |
| Pin Count: | 20 |
| Manufacturer Package Code: | CB-20-2 |
| Reach Compliance Code: | compliant |
| ECCN Code: | EAR99 |
| HTS Code: | 8542.39.00.01 |
| Manufacturer: | Analog Devices Inc |
| Risk Rank: | 5.15 |
| Interface IC Type: | INTERFACE CIRCUIT |
| JESD-30 Code: | R-PBGA-B20 |
| JESD-609 Code: | e1 |
| Length: | 2.5 mm |
| Moisture Sensitivity Level: | 1 |
| Number of Functions: | 1 |
| Number of Terminals: | 20 |
| Operating Temperature-Max: | 85 °C |
| Operating Temperature-Min: | -40 °C |
| Package Body Material: | PLASTIC/EPOXY |
| Package Code: | VFBGA |
| Package Equivalence Code: | BGA20,4X5,20 |
| Package Shape: | RECTANGULAR |
| Package Style: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel): | 260 |
| Power Supplies: | 1.2/5,1.8/5 V |
| Qualification Status: | Not Qualified |
| Seated Height-Max: | 0.65 mm |
| Subcategory: | Other Interface ICs |
| Supply Voltage-Max: | 5.5 V |
| Supply Voltage-Min: | 1.15 V |
| Supply Voltage-Nom: | 1.8 V |
| Supply Voltage1-Max: | 5.5 V |
| Supply Voltage1-Min: | 1.65 V |
| Surface Mount: | YES |
| Temperature Grade: | INDUSTRIAL |
| Terminal Finish: | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
| Terminal Form: | BALL |
| Terminal Pitch: | 0.5 mm |
| Terminal Position: | BOTTOM |
| [email protected] Reflow Temperature-Max (s): | 40 |
| Width: | 2 mm |
1
6.155
6.155
10
5.8413
58.413
100
5.5375
553.75
500
5.2238
2611.9
1000
4.92
4920
