|
RS9113-NB0-D0N
|
REDPINE
|
- |
Tray |
|
WLAN and Bluetooth Wireless Combo Module |
|
48.6955 |
|
ENW-F9208A1EF
|
PANASONIC
|
- |
Tape and Reel |
|
WLAN+BT Wireless Combo Module |
|
34.879 |
|
102110419
|
SEEED DEVELOPMENT LIMITED
|
- |
|
|
WiFi and Bluetooth Module that Dual Bands for WiFi Communication |
|
8.722 |
|
EC.20N
|
TAOGLAS LTD
|
- |
|
|
EDGE Connect - Instant IOT Device with On-Board Sensors, Management Platform and NB-IOT Connectivity |
|
317.32 |
|
IW416HN/A1CMP
|
NXP SEMICONDUCTORS
|
- |
|
|
Dual-band 1x1 Wi-Fi 4 and Bluetooth 5.1 Combo SoC |
|
12.0437 |
|
|
9260.NGWGIE.NVK99AC9M
|
INTEL
|
- |
|
|
9260.NGWGIE.NVK99AC9M |
|
79.901 |
|
ATWILC3000-MR110CA
|
MICROCHIP TECHNOLOGY
|
- |
Tray |
|
WLAN+BTCombo Module Chip IEEE 802.11b/g/n Bluetooth v4.0(BLE) Class I/Class II |
|
26.8 |
|
450-0159R
|
LAIRD TECHNOLOGIES
|
- |
Tape and Reel |
|
WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v2.1 + EDR/Bluetooth v3.0/Bluetooth v4.1(BLE) Class II 151-Pin |
|
35.1 |
|
CYW4343WKWBGT
|
CYPRESS SEMICONDUCTOR
|
- |
Tape and Reel |
|
Single-Chip 802.11 b/g/n MAC/Baseband/Radio with Bluetooth 4.1 |
|
9.4373 |
|
MGM13S12F512GN-V2
|
SILICON LABS
|
- |
Tray |
|
EFR32MG13 Mesh SiP Module, 2.4GHz, 512kB Flash, +18 dBm, External Antenna |
|
28.2587 |
|
SN10-22
|
Innocom Mobile Technology Corp.
|
- |
Tray |
|
SIGFOX plus BLE/WiFi/GPS Combo Module for Zone 2 / Zone 4 |
|
26.1793 |
|
STM32WB55CCU6
|
STMICROELECTRONICS
|
- |
Tray |
|
Bluetooth v5.0 and 802.15.4 With Microcontroller Combo module |
|
12.522 |
|
CC1350F128RSMT
|
NATIONAL SEMICONDUCTOR
|
- |
|
|
wireless MCU targeting Bluetooth, ZigBee remote control applications |
|
13.563 |
|
LBEE5XV1YM-574
|
MURATA MANUFACTURING
|
- |
|
|
WAN and Bluetooth Combo Module |
|
36.5827 |
|
CC1310F32RGZT
|
TEXAS INSTRUMENTS
|
- |
2.5/3.3(V) |
|
Cost-effective, ultra-low-power Wi-Fi, Bluetooth® low energy, Sub-1 GHz, Ethernet, Zigbee, Thread, and host MCU |
|
6.442 |
|
|
CC1350F128RGZT
|
NATIONAL SEMICONDUCTOR
|
- |
|
|
wireless MCU targeting Bluetooth, ZigBee remote control applications |
|
13.982 |
|
WYSBHVGXG
|
TAIYO YUDEN
|
- |
Tape and Reel |
|
Wireless LAN and Bluetooth Module |
|
35.94 |
|
ST60-SIPT-C
|
LAIRD TECHNOLOGIES
|
- |
Tape and Reel |
|
WLAN+BTCombo Module IEEE 802.11a/b/g/n/ac Bluetooth v4.2(BLE) + EDR Class I 84-Pin LGA |
|
84.0444 |
|
WFI32E01PE-I
|
MICROCHIP TECHNOLOGY
|
- |
|
|
Standalone Wi-Fi MCU Module |
|
23.82 |
|
88W8977-A1-EADE/AZ
|
NXP SEMICONDUCTORS
|
- |
|
|
WLAN/Bluetooth/NFC/FM Receive Single-Chip SoC |
|
13.2563 |
|
|
ATWINC3400-MR210CA131
|
MICROCHIP TECHNOLOGY
|
- |
|
|
IEEE 802.11 b/g/n Network Controller with Integrated Bluetooth Low Energy Module |
|
24.56 |
|
LBEE5KL1DX-883
|
MURATA MANUFACTURING
|
- |
Tape and Reel |
|
Wi-Fi Enabled IEEE 802.11 b/g/n + Bluetooth 4.1 |
|
19.5161 |
|
ATWINC3400-MR210CA122
|
MICROCHIP TECHNOLOGY
|
- |
Tray |
|
WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) Class I/Class II 36-Pin |
|
31.2001 |
|
|
ATWILC3000-MR110UA
|
MICROCHIP TECHNOLOGY
|
- |
Tray |
|
WLAN+BTCombo Module Chip IEEE 802.11b/g/n Bluetooth v4.0(BLE) Class I/Class II |
|
23.197 |
|
RS9116W-SB00-QMS-B24
|
SILICON LABS
|
- |
|
|
WLAN and Bluetooth Combo System on Chip |
|
21.8811 |
