| ： | ADG2108BCPZ-HS-RL7 |
|---|---|
| ： | Communication & Networking ICs |
| ： | Analog Devices |
| ： | device is packa |
| ： | - |
| ： | 32-LFCSP-VQ (5x5) |
| ： | YES |
| TYPE | DESCRIPTION |
| Manufacturer Part Number: | ADG2108BCPZ-HS-RL7 |
| Pbfree Code: | Yes |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Active |
| Ihs Manufacturer: | ROCHESTER ELECTRONICS LLC |
| Part Package Code: | QFN |
| Package Description: | HVQCCN, |
| Pin Count: | 32 |
| Reach Compliance Code: | unknown |
| Manufacturer: | Rochester Electronics LLC |
| Risk Rank: | 5.35 |
| Analog IC - Other Type: | CROSS POINT SWITCH |
| JESD-30 Code: | S-XQCC-N32 |
| JESD-609 Code: | e3 |
| Length: | 5 mm |
| Moisture Sensitivity Level: | 3 |
| Number of Channels: | 10 |
| Number of Functions: | 1 |
| Number of Terminals: | 32 |
| Off-state Isolation-Nom: | 69 dB |
| On-state Resistance Match-Nom: | 4.5 Ω |
| On-state Resistance-Max (Ron): | 50 Ω |
| Operating Temperature-Max: | 85 °C |
| Operating Temperature-Min: | -40 °C |
| Package Body Material: | UNSPECIFIED |
| Package Code: | HVQCCN |
| Package Shape: | SQUARE |
| Package Style: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel): | 260 |
| Seated Height-Max: | 1 mm |
| Supply Voltage-Max (Vsup): | 13.2 V |
| Supply Voltage-Min (Vsup): | 10.8 V |
| Supply Voltage-Nom (Vsup): | 12 V |
| Surface Mount: | YES |
| Switch-off Time-Max: | 250 ns |
| Switch-on Time-Max: | 185 ns |
| Technology: | CMOS |
| Temperature Grade: | INDUSTRIAL |
| Terminal Finish: | MATTE TIN |
| Terminal Form: | NO LEAD |
| Terminal Pitch: | 0.5 mm |
| Terminal Position: | QUAD |
| [email protected] Reflow Temperature-Max (s): | 40 |
| Width: | 5 mm |
1
21.6
21.6
10
20.52
205.2
100
19.44
1944
500
18.36
9180
1000
17.28
17280
