| ： | 74LVCH16244AEV,157 |
|---|---|
| ： | Logic ICs |
| ： | NXP USA Inc. |
| ： | IC BUF NON-INVE |
| ： | - |
| ： | 56-VFBGA |
| ： | YES |
| TYPE | DESCRIPTION |
| Manufacturer Part Number: | 74LVCH16244AEV,157 |
| Brand Name: | Nexperia |
| Rohs Code: | No |
| Part Life Cycle Code: | Obsolete |
| Ihs Manufacturer: | NEXPERIA |
| Part Package Code: | BGA |
| Package Description: | VFBGA-56 |
| Pin Count: | 56 |
| Manufacturer Package Code: | SOT702-1 |
| Reach Compliance Code: | not_compliant |
| HTS Code: | 8542.39.00.01 |
| Manufacturer: | Nexperia |
| Risk Rank: | 5.24 |
| Family: | LVC/LCX/Z |
| JESD-30 Code: | R-PBGA-B56 |
| JESD-609 Code: | e0 |
| Length: | 7 mm |
| Logic IC Type: | BUS DRIVER |
| Moisture Sensitivity Level: | 2 |
| Number of Bits: | 4 |
| Number of Functions: | 1 |
| Number of Ports: | 2 |
| Number of Terminals: | 56 |
| Operating Temperature-Max: | 125 °C |
| Operating Temperature-Min: | -40 °C |
| Output Characteristics: | 3-STATE |
| Output Polarity: | TRUE |
| Package Body Material: | PLASTIC/EPOXY |
| Package Code: | VFBGA |
| Package Shape: | RECTANGULAR |
| Package Style: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel): | 240 |
| Propagation Delay (tpd): | 11.3 ns |
| Seated Height-Max: | 1 mm |
| Supply Voltage-Max (Vsup): | 3.6 V |
| Supply Voltage-Min (Vsup): | 1.65 V |
| Supply Voltage-Nom (Vsup): | 1.8 V |
| Surface Mount: | YES |
| Technology: | CMOS |
| Temperature Grade: | AUTOMOTIVE |
| Terminal Finish: | Tin/Lead (Sn63Pb37) |
| Terminal Form: | BALL |
| Terminal Pitch: | 0.65 mm |
| Terminal Position: | BOTTOM |
| [email protected] Reflow Temperature-Max (s): | 20 |
| Width: | 4.5 mm |
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