| ： | 89HPES12T3G2ZBBCGI |
|---|---|
| ： | Interface ICs |
| ： | Renesas |
| ： | 12-lane, 3-port |
| ： | - |
| ： | 324-BGA |
| ： | YES |
| TYPE | DESCRIPTION |
| Manufacturer Part Number: | 89HPES12T3G2ZBBCGI |
| Brand Name: | Integrated Device Technology |
| Pbfree Code: | Yes |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Active |
| Ihs Manufacturer: | INTEGRATED DEVICE TECHNOLOGY INC |
| Part Package Code: | CABGA |
| Package Description: | 19 X 19 MM, 1 MM PITCH, GREEN, MS-034/AAAG-1, CABGA-324 |
| Pin Count: | 324 |
| Manufacturer Package Code: | BCG324 |
| Reach Compliance Code: | compliant |
| ECCN Code: | EAR99 |
| HTS Code: | 8542.39.00.01 |
| Manufacturer: | Integrated Device Technology Inc |
| Risk Rank: | 1.42 |
| Samacsys Description: | PCI Interface IC PCI EXPRESS SWITCH |
| Bus Compatibility: | PCI |
| Clock Frequency-Max: | 125 MHz |
| Drive Interface Standard: | IEEE 1149.1 |
| JESD-30 Code: | S-PBGA-B324 |
| JESD-609 Code: | e1 |
| Length: | 19 mm |
| Moisture Sensitivity Level: | 3 |
| Number of Terminals: | 324 |
| Operating Temperature-Max: | 85 °C |
| Operating Temperature-Min: | -40 °C |
| Package Body Material: | PLASTIC/EPOXY |
| Package Code: | BGA |
| Package Equivalence Code: | BGA324,18X18,40 |
| Package Shape: | SQUARE |
| Package Style: | GRID ARRAY |
| Peak Reflow Temperature (Cel): | 260 |
| Power Supplies: | 1,2.5,3.3 V |
| Qualification Status: | Not Qualified |
| Seated Height-Max: | 1.72 mm |
| Subcategory: | Bus Controllers |
| Supply Voltage-Max: | 1.1 V |
| Supply Voltage-Min: | 0.9 V |
| Supply Voltage-Nom: | 1 V |
| Surface Mount: | YES |
| Technology: | CMOS |
| Temperature Grade: | INDUSTRIAL |
| Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form: | BALL |
| Terminal Pitch: | 1 mm |
| Terminal Position: | BOTTOM |
| [email protected] Reflow Temperature-Max (s): | 30 |
| Width: | 19 mm |
| uPs/uCs/Peripheral ICs Type: | BUS CONTROLLER, PCI |
1
214.775
214.775
10
204.0358
2040.358
100
193.2965
19329.65
500
182.5573
91278.65
1000
171.818
171818
