: | 89H32NT24AG2ZCHLGI |
---|---|
: | Interface ICs |
: | Renesas |
: | Pcie Sys Interc |
: | - |
: | 484-FCBGA (23x23) |
: | YES |
TYPE | DESCRIPTION |
Manufacturer Part Number: | 89H32NT24AG2ZCHLGI |
Brand Name: | Integrated Device Technology |
Pbfree Code: | Yes |
Rohs Code: | Yes |
Part Life Cycle Code: | Active |
Ihs Manufacturer: | INTEGRATED DEVICE TECHNOLOGY INC |
Part Package Code: | FCBGA |
Package Description: | 23 X 23 MM, 1 MM PITCH, GREEN, FCBGA-484 |
Pin Count: | 484 |
Manufacturer Package Code: | HLG484 |
Reach Compliance Code: | compliant |
ECCN Code: | EAR99 |
HTS Code: | 8542.39.00.01 |
Manufacturer: | Integrated Device Technology Inc |
Risk Rank: | 1.65 |
Samacsys Description: | FLIP CHIP BGA 23 X 23MM 1.0 MM PITCH |
Additional Feature: | ALSO OPERATES AT 100 MHZ |
Bus Compatibility: | I2C; ISA; VGA |
Clock Frequency-Max: | 125 MHz |
Drive Interface Standard: | IEEE 1149.6AC; IEEE 1149.1 |
JESD-30 Code: | S-PBGA-B484 |
JESD-609 Code: | e1 |
Length: | 23 mm |
Moisture Sensitivity Level: | 4 |
Number of Terminals: | 484 |
Operating Temperature-Max: | 85 °C |
Operating Temperature-Min: | -40 °C |
Package Body Material: | PLASTIC/EPOXY |
Package Code: | BGA |
Package Equivalence Code: | BGA484,22X22,40 |
Package Shape: | SQUARE |
Package Style: | GRID ARRAY |
Peak Reflow Temperature (Cel): | 250 |
Power Supplies: | 1,3.3 V |
Qualification Status: | Not Qualified |
Seated Height-Max: | 2.92 mm |
Subcategory: | Bus Controllers |
Supply Current-Max: | 3400 mA |
Supply Voltage-Max: | 1.1 V |
Supply Voltage-Min: | 0.9 V |
Supply Voltage-Nom: | 1 V |
Surface Mount: | YES |
Technology: | CMOS |
Temperature Grade: | INDUSTRIAL |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal Form: | BALL |
Terminal Pitch: | 1 mm |
Terminal Position: | BOTTOM |
[email protected] Reflow Temperature-Max (s): | NOT SPECIFIED |
Width: | 23 mm |
uPs/uCs/Peripheral ICs Type: | BUS CONTROLLER, PCI |
1
379.175
379.175
10
360.2158
3602.158
100
341.2565
34125.65
500
322.2973
161148.65
1000
303.338
303338