| ： | 0W888-002-XTP |
|---|---|
| ： | Embedded Processors & Controllers |
| ： | onsemi |
| ： | 16 bit Audio Pr |
| ： | - |
| ： | 64-LFBGA (7x7) |
| ： | YES |
| TYPE | DESCRIPTION |
| Manufacturer Part Number: | 0W888-002-XTP |
| Brand Name: | ON Semiconductor |
| Pbfree Code: | Yes |
| Part Life Cycle Code: | Not Recommended |
| Ihs Manufacturer: | ON SEMICONDUCTOR |
| Part Package Code: | BGA |
| Package Description: | LFBGA, |
| Pin Count: | 64 |
| Manufacturer Package Code: | 566AF |
| Reach Compliance Code: | compliant |
| ECCN Code: | 3A001.A.3 |
| HTS Code: | 8542.31.00.01 |
| Factory Lead Time: | 16 Weeks |
| Manufacturer: | ON Semiconductor |
| Risk Rank: | 7.75 |
| Additional Feature: | IT ALSO OPERATES AT NOMINAL 1.25V |
| Barrel Shifter: | YES |
| Boundary Scan: | NO |
| Clock Frequency-Max: | 50 MHz |
| Format: | FIXED POINT |
| Internal Bus Architecture: | MULTIPLE |
| JESD-30 Code: | S-PBGA-B64 |
| Length: | 7 mm |
| Low Power Mode: | YES |
| Number of Terminals: | 64 |
| Operating Temperature-Max: | 85 °C |
| Operating Temperature-Min: | -40 °C |
| Package Body Material: | PLASTIC/EPOXY |
| Package Code: | LFBGA |
| Package Shape: | SQUARE |
| Package Style: | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Qualification Status: | Not Qualified |
| Seated Height-Max: | 1.5 mm |
| Supply Voltage-Max: | 2 V |
| Supply Voltage-Min: | 0.9 V |
| Supply Voltage-Nom: | 1.8 V |
| Surface Mount: | YES |
| Technology: | CMOS |
| Temperature Grade: | INDUSTRIAL |
| Terminal Form: | BALL |
| Terminal Pitch: | 0.8 mm |
| Terminal Position: | BOTTOM |
| Width: | 7 mm |
| uPs/uCs/Peripheral ICs Type: | DIGITAL SIGNAL PROCESSOR, MIXED |
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